koa speer electronics, inc. ss-224 r2 aha 11/06/01 bolivar drive p.o. box 547 bradford, pa 16701 usa 814-362-5536 fax 814-362-8883 www.koaspeer.com page 1 of 8 multilayer ferrite chip bead array type fba 1. scope of application noise suppression in signal i/o lines and other circuits that require multiple chip beads for noise suppression. 2. features the multilayer ferrite chip bead array retains all the features of multilayer ferrite chip beads. in addition, it provides multiple circuits in a single package, which reduce the required land space on pcb and reduce the cost for assembly. 3. dimension and structure table 1 3.1 dimensions certified lwt b pe inch (mm) inch (mm) inch (mm) inch (mm) inch (mm) inch (mm) 0.126 0.008 0.063 0.008 0.031 0.008 0.014 0.008 0.031 0.004 0.012 0.008 (3.20 0.20) (1.60 0.20) (0.80 0.20) (0.35 0.20) (0.80 0.10) (0.30 0.20) l e 1.1 applications computers telecommunications equipment peripherals data communications solder nickel barrier silver metalization electrodes t p b w
5. standard applications fba2b4ate300p 30 0.1 200 fba2b4ate600p 60 0.25 200 fba2b4ate121p 120 0.3 150 fba2b4ate221p 220 0.3 150 fba2b4ate301p 300 0.4 250 fba2b4ate601p 600 0.5 100 fba2b4ate102p 1,000 0.7 50 fba2b4bte121p 120 0.5 100 fba2b4bte221p 220 0.55 100 fba2b4bte471p 470 0.55 100 fba2b4bte601p 600 0.65 100 impedance @ 100mhz ? maximum dc resistance ? allowable dc current (ma) operating temperature -55? to 125? ordering code fba 2b 4 a te 300 p type size circuits characteristics packaging impedance tolerance number a: standard te: tape 2 significant p:?5% of circuits b: high speed & reel figure + 1 7": 3,000 pcs/reel multiplier example: 300 = 30 ? 4. ordering and specifying information* * please note: kse? part numbers do not contain any spaces or hyphens. 2b (1206) bolivar drive p.o. box 547 bradford, pa 16701 usa 814-362-5536 fax 814-362-8883 www.koaspeer.com page 2 of 8 koa speer electronics, inc. ss-224 r2 3. dimension and structure 3.2 circuit
bolivar drive p.o. box 547 bradford, pa 16701 usa 814-362-5536 fax 814-362-8883 www.koaspeer.com page 3 of 8 koa speer electronics, inc. ss-224 r2 6. graphs* |z| xl r *
koa speer electronics, inc. ss-224 r2 bolivar drive p.o. box 547 bradford, pa 16701 usa 814-362-5536 fax 814-362-8883 www.koaspeer.com page 4 of 8 6. graphs* (continued) |z| xl r *
koa speer electronics, inc. ss-224 r2 bolivar drive p.o. box 547 bradford, pa 16701 usa 814-362-5536 fax 814-362-8883 www.koaspeer.com page 5 of 8 6. graphs* (continued) |z| xl r *
koa speer electronics, inc. ss-224 r2 bolivar drive p.o. box 547 bradford, pa 16701 usa 814-362-5536 fax 814-362-8883 www.koaspeer.com page 6 of 8 8. chip quantities per reel parts on 7 inch (178mm) reel chip size 2b (1206) 3,000 0.071?.002 (1.8?.1) 0.138?.002 (3.5?.1) 0.048?.002 (1.2?.1) 1206 (3216) 6. packaging specifications koa s multilayer components are provided on tape-and-reel for use in pick-and-place machines. the reel size is 7 inch. 7. dimensions - inches (mm) tape ao bo ko do e w f po p 2 d 1 p 1 bo ko t ao 0.157?.004 (4.0?.1) 0.157?.004 (4.0?.1) 0.079?.002 (2.00?.05) 0.059?.004 (1.5+0.1/-0.0) 0.039 min. (1.0 min.) 0.009?.001 (0.23?.02) 1206 (3216) tape p 1 po p 2 do d 1 t 0.069?.004 (1.75?.10) 0.138?.002 (3.50?005) 0.318?.002 (8.1?.1) 1206 (3216) tape e f w item requirement conditions operating temperature -55? ~ +125? storage temperature 40? @ 70% humidity sealed plastic bags with desiccant shall be used to reduce the potential of oxidation on the terminations during storage. resistance to solder change in impedance: relative to value before flux: 5-10 sec dip heat test ?0%. after flux: air dry for 15 sec appearance: there shall be no cracking preheat: 150? ?0? solder coverage: more than 75% of the terminal preheat time: 60 sec electrode shall be covered with solder. solder temp: 260? ?? dip time: 10 ? sec 9. characteristics
koa speer electronics, inc. ss-224 r2 bolivar drive p.o. box 547 bradford, pa 16701 usa 814-362-5536 fax 814-362-8883 www.koaspeer.com page 7 of 8 item requirement conditions solderability solder coverage: more than 95% of the flux: 5-10 sec dip termination shall be covered with solder. after flux: air dry for 15 sec solder temp: 245? ?? dip time: 5 ?.5 sec leach resistance appearance: there shall be no visible signs of the bead shall be subjected to the following physical or mechanical damage (i.e. no cracks) 5 steps for the period of time shown below. terminations: termination must not be leached the 5 steps constitute one (1) rotation. away for more than 5%. 4 rotations shall be carried out. 1) flux: 5-10 sec 2) after flux: air dry for 15 sec 3) solder temp: 230? ?? 4) dip time: 5 ?.5 sec 5) cool: air cool for 60 seconds insulation resistance insulation resistance: min 1g ohms solvent resistance change in impedance: relative to value before cleaning by: test ?0%. washer: ultrasonic washer (100w) solvent: isopropyl alcohol time: 3 minutes terminal strength appearance: the terminal electrode shall not type w(kgf) time (hanging test) break off, nor shall there be damage to the body. 1206 1.5 30 sec ? sec terminal strength appearance: there shall be no evidence of type w(kgf) time (push test) mechanical degradations to terminals or body. 1206 2.3 60 sec bending strength appearance: there shall be no physical or board: 90x40x1.6mm mechanical damage bend: 1mm impedance: relative to initial value before time: 5 sec test ?0% mechanical shock appearance: there shall be no physical or force: 50g mechanical damage time: 11 msec impedance: relative to initial value before test there shall be 3 shocks in each of 6 directions ?0% (18 shocks total). vibration impedance: relative to initial value ?0% only endurance conditioning by sweeping shall be made. the entire frequency range from 10-2,000hz and return to 10hz in 20 minutes (this shall constitute one cycle). amplitude: 1.5mm the test shall have a 15g peak and shall be applied for a period of 4 hours (12 cycles) in each of 3 mutually perpendicular directions (a total of 36 cycles within a total of 12 hours). 9. characteristics (continued)
koa speer electronics, inc. ss-224 r2 bolivar drive p.o. box 547 bradford, pa 16701 usa 814-362-5536 fax 814-362-8883 www.koaspeer.com notice: the information contained in this spec sheet is believed to be accurate and up-to-date. koa speer electronics reserves this right to change these specifications without notice. page 8 of 8 10. recommended pc board land patterns - inches (mm) chip component size size lw abc e 1206 .020 .039 .020 .059 .012 .020 (3216) (0.5 x n) (1.0) (0.5) (1.5) (0.3) (0.5) soldering pad chip component l c e bwa item requirement conditions thermal shock appearance: there shall be no physical or step temperature time mechanical damage. 1-start -40? ?? impedance: relative to initial value ?0%. 2-hold -40? ?? 30 min ? min dcr: the dcr shall not exceed initial specified 3-transfer 0.5 min max. value. 4-hold +105? ?? 30 min ? min 5-transfer 0.5 min max. testing of the parts will be made at 0 hours, 250 hours and 500 hours. before testing the parts steps 1 thru 5 constitute one complete cycle shall be allowed to cool to room temperature for and the test shall consist of a total of 500 24 hours. cycles. load humidity appearance: there shall be no physical or temperature: 85? ?? mechanical damage relative humidity: 85% impedance: relative to initial value ?5% time: 1,000 hours total apply: 100% rated current measurements shall be taken at 0 hours, 250 hours, 500 hours and 1,000 hours and shall meet the conditions stated above. life test appearance: there shall be no physical or temperature: 85? ?? mechanical damage time: 1,000 hours total impedance: relative to initial value ?5% apply: 100% rated current measurements shall be taken at 0 hours, 250 hours, 500 hours and 1,000 hours and shall meet the conditions stated above. 9. characteristics (continued)
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